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Structural & Non-structural Panels

Modelling of the Lamination Process of Fiberboard and ParticleboardCompleted

Project leaders: Cloutier, Alain
 

Objective:

Develop a model of the hygromechanical warping occurring during the lamination process of fiberboard (MDF et HDF) and particleboard. This research will:

  • Develop a finite element model of heat and mass transfer occurring during the heat lamination process for MDF and HDF panels;
  • Develop a finite element model of hygromechanical warping of MDF and HDF panels as a result of changes in paper size and finishing and moisture movement in the finished panels by thermal gradients;
  • Use the model to optimize the panel properties for lamination

Start date: 2003-04-09 End date: 2006-03-09
 

Results:

Reports:

 

For more information on this project, please contact:

Cloutier, Alain
Laval University
Email: Alain.Cloutier@sbf.ulaval.ca
Telephone: (418) 656-5851
Fax: (418) 656-5263
 
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